Leading Europe into the Intelligent Digital Future

INSIDE is the European Technology Platform (ETP) dedicated to Research, Development, and Innovation (RD&I) in Intelligent Digital Systems, covering the entire value chain, spanning foundational technologies to real-world
applications across key sectors.

Empower

Connect with 270+ global companies, SMEs, startups, universities, and research institutes. Learn, contribute, and drive innovation through collaborative events, workshops, and research.

Collaborate

Collaborate on high-impact projects with financial support from CHIPS-JU, Horizon Europe, Xecs, and the Chips Act vision. Co-develop cutting-edge technologies for a smarter, more sustainable future

Shape

Shape the future of Intelligent Digital Systems in Europe. Take a leading role in defining strategic priorities, co-authoring research agendas, and driving leadership across the entire ECS value chain.

News

INSIDE and EPoSS Publish Joint European Roadmap for Edge AI

The European associations INSIDE and EPoSS have released a landmark publication: Artificial Intelligence at the Edge – A Joint European Roadmap for Edge AI.

This collaborative roadmap provides a comprehensive vision for strengthening Europe’s position in the rapidly advancing field of Artificial Intelligence (AI) at the edge of the computing continuum.

Get Your Issue of INSIDE Magazine 10 Today!


In this issue of INSIDE Magazine, we explore the frontiers of computation, the vibrancy of our community, and the evolving landscape of science, design, and collaboration.

Read the latest issue and stay ahead of the technologies and policies shaping the future of European industry.

Building Europe SemiConductor Future


In response to rising geopolitical pressures, nine EU nations have launched the Semiconductor Coalition—a unified effort to boost Europe’s chipmaking capacity, innovation, and strategic autonomy. Backed by €43B from the EU Chips Act, the initiative aims to strengthen resilience and global competitiveness.

Europe is ready to lead—with internationalism, innovation, and investment.

Discover How Arrowhead fPVN is Revolutionizing Industry with Seamless IoT Integration

The Arrowhead fPVN project boosts industrial productivity in Europe by improving data interoperability, flexibility, and resilience in sectors like automotive and aerospace. A new CLI tool simplifies development, automates tasks, and enables faster, more efficient integration.

Chips IT joins inside to drive innovation in Semiconductors design

We’re excited to welcome Fondazione Chips-IT ! As Italy’s top Research Institute for Integrated Circuit Design, they bridge industry and academia, advancing semiconductor innovation. This partnership strengthens our mission to drive global research, accelerate breakthroughs, and support the next generation of semiconductors.

Discover AIMS5.0 = The Future of EuropeAn Manufacturing

AIMS5.0 is revolutionizing European manufacturing with AI and IoT, driving Industry 5.0. This €70M EU-funded project enhances digital sovereignty, resilient supply chains, and sustainable factories, cutting time-to-market by 20%, reducing environmental impact by 20%, and halving equipment monitoring time.

Svensk Elektronik Joins INSIDE to Strengthen Eu’s Semiconductor Ecosystem

We’re excited to welcome Svensk Elektronik as a member of INSIDE, giving them access to key networks, knowledge, and projects like Semicon Sweden. As Sweden’s top electronics trade organization, Svensk Elektronik drives industry growth and global competitiveness, while advocating for key issues with stakeholders like government bodies and regulators.

Events

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Thematic Workshops
Thematic Workshops

📅 2025-11-13 – 2025-11-14
📍 Budapest, Hungary


Our Thematic Workshops aim to bring our community together in a cohesive and collaborative way around challenging and promising technologies. These workshops serve as a platform to envision tomorrow’s innovation projects and enhance the quality of our project proposals. Through a series of focused sessions, we study and analyze key technology areas relevant to our […]

EFECS 2025
EFECS 2025

📅 2025-12-03 – 2025-12-04
📍 St. Julian’s, Malta


We’re excited to announce that the next edition of the European Forum For Electronic Component & Systems (EFECS) – co-organised by INSIDE, Chips Joint Undertaking , AENEAS Association and EPoSS Association – will take place on December 3 & 4 — returning to the location where the ECS journey first began in 2017.

ECS Brokerage 2026
ECS Brokerage 2026

📅 2026-02-04 – 2026-02-05
📍 The EGG, Brusssel


Co-organised by AENEAS, EPoSS and INSIDE Industry Associations, the ECS Brokerage will once again bring together stakeholders from across the Electronic Components and Systems community to: Exchange innovative R&D project ideas Meet potential partners and build future consortia Prepare project proposals for the upcoming Chips JU Calls Please note that a participation fee is requested […]


INSIDE is as much about coming to understand one’s own competencies as it is about developing new ones. “In too many cases, people think they can ask a company to come and help them. This will not work in the long term as you don’t have the core competencies yourself. You have to understand the level of competency your organisation needs to be functional and competitive.

—Jerker Delsing – Lulea University of Technology

INSIDE Newsletter

Stay up to date with the latest ECS news & trends in our bi-weekly INSIDE Newsletter!

In a world defined by rapid technological advancements and shifting global dynamics, Europe finds itself at the crossroads of opportunity and responsability. In this dilemna, Europe’s competitive edge lies in its ability to innovate while remaining faithful to its values of collaboration, sustainability, and inclusivity.

– Paolo Azzoni – Secretary General, INSIDE