Leading Europe into the Intelligent Digital Future
As a strategic driver of Europe’s technological strategic autonomy, INSIDE serves as the official representative of the digital community within the Chips Joint Undertaking, contributing to the EU Chips Act’s mission
to foster a resilient and competitive semiconductor ecosystem in Europe.
INSIDE is the European Technology Platform (ETP) dedicated to Research, Development, and Innovation (RD&I) in Intelligent Digital Systems, covering the entire value chain, spanning foundational technologies to real-world
applications across key sectors.
Empower
Connect with 270+ global companies, SMEs, startups, universities, and research institutes. Learn, contribute, and drive innovation through collaborative events, workshops, and research.
Shape
Shape the future of Intelligent Digital Systems in Europe. Take a leading role in defining strategic priorities, co-authoring research agendas, and driving leadership across the entire ECS value chain.
Our journey in numbers: from ARTEMIS to Chips JU
News
Get Your Issue of INSIDE Magazine 10 Today!
In this issue of INSIDE Magazine, we explore the frontiers of computation, the vibrancy of our community, and the evolving landscape of science, design, and collaboration.
Read the latest issue and stay ahead of the technologies and policies shaping the future of European industry.
Building Europe SemiConductor Future
In response to rising geopolitical pressures, nine EU nations have launched the Semiconductor Coalition—a unified effort to boost Europe’s chipmaking capacity, innovation, and strategic autonomy. Backed by €43B from the EU Chips Act, the initiative aims to strengthen resilience and global competitiveness.
Europe is ready to lead—with internationalism, innovation, and investment.
Discover How Arrowhead fPVN is Revolutionizing Industry with Seamless IoT Integration
The Arrowhead fPVN project boosts industrial productivity in Europe by improving data interoperability, flexibility, and resilience in sectors like automotive and aerospace. A new CLI tool simplifies development, automates tasks, and enables faster, more efficient integration.
Chips IT joins inside to drive innovation in Semiconductors design
We’re excited to welcome Fondazione Chips-IT ! As Italy’s top Research Institute for Integrated Circuit Design, they bridge industry and academia, advancing semiconductor innovation. This partnership strengthens our mission to drive global research, accelerate breakthroughs, and support the next generation of semiconductors.
Discover AIMS5.0 = The Future of EuropeAn Manufacturing
AIMS5.0 is revolutionizing European manufacturing with AI and IoT, driving Industry 5.0. This €70M EU-funded project enhances digital sovereignty, resilient supply chains, and sustainable factories, cutting time-to-market by 20%, reducing environmental impact by 20%, and halving equipment monitoring time.
Svensk Elektronik Joins INSIDE to Strengthen Eu’s Semiconductor Ecosystem
We’re excited to welcome Svensk Elektronik as a member of INSIDE, giving them access to key networks, knowledge, and projects like Semicon Sweden. As Sweden’s top electronics trade organization, Svensk Elektronik drives industry growth and global competitiveness, while advocating for key issues with stakeholders like government bodies and regulators.
Events
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INSIDE Connect 2025
📅 2025-09-03 – 2025-09-04
📍 Málaga, Spain
We’re proud to launch 𝐈𝐍𝐒𝐈𝐃𝐄 𝐂𝐨𝐧𝐧𝐞𝐜𝐭—an exclusive members-only event designed to reconnect our community, spark collaboration, and define our shared future. Bringing together diverse perspectives and bold ideas, this is where connections become direction—and where tomorrow begins, together.
11th IEEE International Smart Cities Conference – ISC2 2025
📅 2025-10-06 – 2025-10-09
📍 Patras, Greece
Join us at the ENSURE Workshop during the 11th IEEE International Smart Cities Conference (ISC2 2025) in Patras, Greece, on October 6th. From edge AI and CPSoS to regulatory compliance and citizen trust, ENSURE offers a holistic look at the future of urban innovation. Submit your papers July 20th.
EFECS 2025
📅 2025-12-03 – 2025-12-04
📍 St. Julian’s, Malta
We’re excited to announce that the next edition of the 𝐄𝐮𝐫𝐨𝐩𝐞𝐚𝐧 𝐅𝐨𝐫𝐮𝐦 𝐟𝐨𝐫 𝐄𝐥𝐞𝐜𝐭𝐫𝐨𝐧𝐢𝐜 𝐂𝐨𝐦𝐩𝐨𝐧𝐞𝐧𝐭𝐬 𝐚𝐧𝐝 𝐒𝐲𝐬𝐭𝐞𝐦𝐬 (EFECS) – co-organised by INSIDE, Chips Joint Undertaking , AENEAS Association and EPoSS Association – will take place on 𝗗𝗲𝗰𝗲𝗺𝗯𝗲𝗿 𝟯–𝟰 — returning to the location where the ECS journey first began in 2017.
INSIDE is as much about coming to understand one’s own competencies as it is about developing new ones. “In too many cases, people think they can ask a company to come and help them. This will not work in the long term as you don’t have the core competencies yourself. You have to understand the level of competency your organisation needs to be functional and competitive.
—Jerker Delsing – Lulea University of Technology
INSIDE Newsletter
Stay up to date with the latest ECS news & trends in our bi-weekly INSIDE Newsletter!
In a world defined by rapid technological advancements and shifting global dynamics, Europe finds itself at the crossroads of opportunity and responsability. In this dilemna, Europe’s competitive edge lies in its ability to innovate while remaining faithful to its values of collaboration, sustainability, and inclusivity.
– Paolo Azzoni – Secretary General, INSIDE