We are absolutely delighted to invite the global INSIDE community to join us in Palermo, Southern Italy, for the upcoming Roadmapping Forum. This remarkable city offers a truly distinctive setting that pairs a robust academic and research foundation with an incredibly vibrant, layered cultural backdrop. INSIDE Connect 2026 is where our interdisciplinary, inclusive, and forward-thinking […]

Join the leaders shaping Europe’s semiconductor future at FIRST by FMD, taking place 30 September – 1 October 2026 in Berlin. FIRST is a high-level trend forum for those who turn technology into industrial leadership. Semiconductors are the foundation of economic resilience, technological sovereignty, security, and sustainable growth. With initiatives such as the EU Chips […]

Join the Xecs Matchmaking Event 2026 on 6-7 October in Vienna to start shaping your next Xecs Call 6 collaboration. This annual event brings together ECS community to connect with right partners, refine project ideas and build strong, competitive consortia. Whether you are SME, large company, RTO or academic organisation, it is designed to help […]

In preparation for the Work Programme for 2027, Chips JU is organising an online consultation workshop on the 6th of October 2026. The workshop will focus on the broader theme of Chips for AI, AI for Chips. It will bring together stakeholders from across the Electronic Components and Systems community to discuss ideas for potential […]

Eclipse SDV Hackathon Chapter 4 is bringing developers, engineers, automotive experts and innovators together for an intensive hands-on event focused on building, experimenting and solving real SDV challenges! Over the course of the hackathon, participants will have the opportunity to: 🔧 Develop and test innovative SDV solutions 💡 Experiment with Eclipse SDV technologies 🤝 Collaborate […]

SEMICON Europa 2026 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain. – Top-notch Keynotes – Market Trends – Exhibition – Networking – Advanced Packaging Forum / Fab Management Forum – Sustainability – Smart Manufacturing / Mobility […]

Join us from 𝟮 – 𝟯 𝗗𝗲𝗰𝗲𝗺𝗯𝗲𝗿, 𝟮𝟬𝟮𝟲, in 𝗛𝗲𝗹𝘀𝗶𝗻𝗸𝗶, 𝗙𝗶𝗻𝗹𝗮𝗻𝗱, for the next edition of the European Forum for Electronic Components and Systems, for a full week of networking opportunities and cultural activities! Hosted at the 𝗠𝗲𝘀𝘀𝘂𝗸𝗲𝘀𝗸𝘂𝘀 𝗛𝗲𝗹𝘀𝗶𝗻𝗸𝗶 𝗘𝘅𝗽𝗼 𝗮𝗻𝗱 𝗖𝗼𝗻𝘃𝗲𝗻𝘁𝗶𝗼𝗻 𝗖𝗲𝗻𝘁𝗿𝗲, EFECS 2026 will gather Europe’s semiconductor and ECS community under the theme: […]

The CPS summer school is targeted at students, research scientists, and R&D experts from academia and industry, who want to learn about CPS engineering and applications. The program will cover all the design phases of CPSs, starting from the conception of the idea down to the definition of the final system and will discuss the […]

Explore the latest developments in microelectronics, semiconductor technologies, sensors and microsystems at the upcoming IMAPS and COE events. The IMAPS programme covers a broad range of topics, including hybrid and semiconductor technologies, design methods and computer simulations, electronic materials and components, microcircuit applications, thick-film and thin-film technologies, sensors and sensing materials, packaging and PCB technologies, […]

The University of Malta, as a partner of the Malta Semiconductors Competence Centre, invites to register for the online course „Design for Electromagnetic Compatibility“ offered by the University Semiconductors Competence Centre. This four-day online course is taught in English and available free of charge, but with limited slots. It introduces essential concepts of electromagnetic interference […]

Microelectronics is a wide technological sector for the development of Integrated Circuits (CHIPS!!). Chips need to be designed, fabricated, tested and assembled. They can be further combined in electronic systems, which shall be powered and animated with the soul of software. The ability of these systems to manage or exchange information with their environment sustains […]

Save the Date for the upcoming Webinar, jointly organised by Chips JU, ICOS², JASMINE and INPACE on Monday 6 July at 13h CEST. This webinar aims to raise awareness of the two Chips JU Calls: The EU-Japan Call on Semiconductor ( DIGITAL-JU-Chips-2026-SG-JAPAN) The Call with Digital Partnership and TTC countries ( HORIZON-JU-Chips-2026-3-RIA) The calls will […]

The Chips Joint Undertaking is organising an information session dedicated to two forthcoming funding opportunities aimed at strengthening Europe’s AI compute infrastructure: DIGITAL-JU-CHIPS-2026-AI1-SG DIGITAL-JU-CHIPS-2026-AI-GfP The event is particularly relevant for: AI chip design companies System integrators Cloud service providers EuroHPC AI Factories and public AI infrastructure operators Data centre operators Power, cooling, and connectivity suppliers […]

Join the Info Session on the Chips 2026 Call on 6G Front End Module (FEM) – 2 July 2026 Ahead of the launch of the Chips JU 6G Front End Module (FEM) Call on 7 July 2026, to help the community better understand this upcoming opportunity and prepare future collaborations, we are pleased to invite […]

IEEE/IFIP Network Operations and Management Symposium (NOMS) has merged with its sister conference IM, bringing together the best of both outstanding conferences. This premier event brings together experts to explore the latest advancements in network operations and management. With keynotes, technical sessions, tutorials, and workshops, NOMS covers topics like network management, service management, business management, […]

The APC|M Conference offers researchers, developers, manufacturers, suppliers, and members of the scientific community a first-class platform for exchanging ideas in the fields of advanced process control and manufacturing effectiveness. Whether you are involved in the production of semiconductors, photovoltaic modules, LEDs, flat panel displays or MEMS, the APCM offers valuable contacts, helpful know-how and […]

The 27th DATE conference is the main European event bringing together designers and design automation users, researchers and vendors as well as specialists in hardware and software design, test and manufacturing of electronic circuits and systems. DATE puts strong emphasis on both technology and systems, covering ICs/SoCs, emerging technologies, embedded systems and embedded software. The […]