The brokerage will take place in conjunction with and is kindly hosted by the Fraunhofer IZM Electronic Packaging Days 2025.    Chips JU will launch calls for Lab to Fab transfer of Advanced Packaging from the Chips JU pilot lines into industry. The goal of the workshop on November 7 is to inform the community […]

Our Thematic Workshops aim to bring our community together in a cohesive and collaborative way around challenging and promising technologies. These workshops serve as a platform to envision tomorrow’s innovation projects and enhance the quality of our project proposals. Through a series of focused sessions, we study and analyze key technology areas relevant to our […]

SEMICON Europa 2025 is co-located with productronica and will take place in November 18-21, 2025 in Munich, Germany. This year’s theme Global Collaborations for European Economic Resilience expresses that global collaborations are not just beneficial for Europe’s resilience, they are essential. In today’s interconnected world, Europe cannot afford to operate in isolation. By working closely […]

We’re excited to announce that the next edition of the European Forum For Electronic Component & Systems (EFECS) – co-organised by INSIDE, Chips Joint Undertaking , AENEAS Association and EPoSS Association – will take place on December 3 & 4 — returning to the location where the ECS journey first began in 2017.

The HiPEAC conference is the premier European forum for experts in computer architecture, programming models, compilers and operating systems for general-purpose, embedded and cyber-physical systems. Areas of focus and integration include safety-critical dependencies, cybersecurity, energy efficiency and machine learning. The HiPEAC 2026 conference will take place in Kraków, poland. Associated workshops, tutorials, special sessions, several […]

Co-organised by AENEAS, EPoSS and INSIDE Industry Associations, the ECS Brokerage will once again bring together stakeholders from across the Electronic Components and Systems community to: Exchange innovative R&D project ideas Meet potential partners and build future consortia Prepare project proposals for the upcoming Chips JU Calls Please note that a participation fee is requested […]

Looking to launch or join an impactful project in Electronic Components and Systems (ECS)? Join the Xecs Matchmaking Event on 9 October 2025 in Riga, Latvia. A full day of networking, project idea pitching, and expert insights to help you prepare for Xecs Call 5. Meet public authorities, explore funding opportunities, and connect with potential […]

This year’s theme is: “Accelerate the innovation of engineering”. The need for innovative systems engineering methodologies is more critical than ever to sustain and enhance the competitive edge of our high-tech industry. This event will explore this vital theme through various subtopics and insights and will examine how generative AI and model-based techniques can be […]

Join us at the ENSURE Workshop during the 11th IEEE International Smart Cities Conference (ISC2 2025) in Patras, Greece, on October 6th. From edge AI and CPSoS to regulatory compliance and citizen trust, ENSURE offers a holistic look at the future of urban innovation. Submit your papers July 20th.

AI & Big Data Expo Europe is the leading event for Generative AI, Enterprise AI, Machine Learning, Security, Ethical AI, Deep Learning, Data Ecosystems, and NLP.

Cyber Security & Cloud Expo Europe is the leading event covering Zero-Day Vigilance, Threat Detection, Global Cyber Conflicts, Generative AI, Quantum Computing, Risk Management, Cloud Transformation, Hybrid Cloud strategies, DevSecOps Integration and AI & ML in Infrastructure.

The Chips Joint Undertaking is organising a series of workshops to explore topics for potential inclusion in the Work Programme 2026. Among topics under consideration is an Innovation Action (IA) topic on “Power Electronics for a prosperous and resilient Europe”  Power electronics are of crucial importance for the EU’s path towards successful integration of renewable energies. […]

The CPS summer school is targeted at students, research scientists, and R&D experts from academia and industry, who want to learn about CPS engineering and applications. The program will cover all the design phases of CPSs, starting from the conception of the idea down to the definition of the final system and will discuss the […]

The EPoSS Working Group Advanced Packaging invites to the Pre-Brokerage for Lab to Fab Accelerator projects on Advanced Packaging taking place on September 18, 2025 15:30 – 17:30 CEST in Grenoble, France, at the World Trade Center (onsite only) The workshop has been arranged in conjunction with and is kindly hosted by the EMPC 2025 […]

Now in its third year, Open Source Congress is dedicated to fostering global dialogue, collaboration, and strategic development of the open source ecosystem by gathering code-producing open source software foundations’ leadership in an intimate, facilitated forum. This first time OSC-adjacent event will be attended by foundation leadership, where they will also be joined by leadership […]

Do you have an innovative idea in the domain of software innovation? Join the ITEA PO Days for ITEA Call 2025! This networking event will support you in creating high-quality project proposals and building a strong consortium. For more information and registration, visit the dedicated PO Days 2025 website.