Call Programme: ECS R&I
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ECS GLOBAL RIA (second phase)
A bottom-up call for lower-TRL activities (3-4) aimed at establishing new knowledge and tech feasibility.
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Call for Reinforcing Europe’s strength in power electronics
A resilience call aiming to scale Europe’s power electronics to 300mm device production and adopt agile design.
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Call for Reinforcing Europe’s strength in photonics
Supports the industrial scale-up of advanced photonic platforms to bridge the gap between research and production.
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Call for Reinforcing Europe’s strength in health
Focuses on healthcare transformation via advanced imaging, home-based care, and high-performance instrumentation.
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ECS Supply chain resilience CSA
Aims to enhance resilience by developing a “digital twin” data platform for monitoring disruptions and stress tests. No co-financing by Chips JU Participating States following Article 141(2) SBA (100% HE funding).
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ECS GLOBAL IA (second phase)
A bottom-up call for high-TRL projects (5-8) across the ECS value chain.
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ECS International collaboration – Call with Digital Partnership and TTC countries
Fosters low-TRL collaboration with India, Singapore, and Taiwan on chip design, manufacturing, and packaging. No co-financing by Chips JU Participating States following Article 141(2) SBA (100% HE funding).
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IA Resilience call reinforcing Europe’s strenght in power electronics
IA Resilience call reinforcing Europe’s strenght in power electronics
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Preparing a European autonomous driving stack ecosystem building on next-generation SDV software and hardware computing architectures
Coordinates European vehicle initiatives to establish an open reference architecture and sustainable roadmap.
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IA Resilience call reinforcing Europe’s strength in photonics
IA Resilience call reinforcing Europe’s strength in photonics