Targets the design and implementation of integrated microelectronic building blocks for 6G radio communication Front End Modules.

IA Resilience call reinforcing Europe’s strenght in health

IA Resilience call reinforcing Europe’s strength in photonics

Fosters low-TRL collaboration with India, Singapore, and Taiwan on chip design, manufacturing, and packaging. No co-financing by Chips JU Participating States following Article 141(2) SBA (100% HE funding).

IA Resilience call reinforcing Europe’s strenght in power electronics

A resilience call aiming to scale Europe’s power electronics to 300mm device production and adopt agile design.

Supports the industrial scale-up of advanced photonic platforms to bridge the gap between research and production.

Focuses on healthcare transformation via advanced imaging, home-based care, and high-performance instrumentation.

Coordinates European vehicle initiatives to establish an open reference architecture and sustainable roadmap.

Aims to enhance resilience by developing a “digital twin” data platform for monitoring disruptions and stress tests. No co-financing by Chips JU Participating States following Article 141(2) SBA (100% HE funding).

First call of Stream A in the AI chips and systems for EU compute infrastructure initiative, aiming at AI chip demonstrators to support cutting-edge European chip designers to showcase operational silicon hardware ready for infrastructure integration.

Stream B in the AI chips and systems for EU compute infrastructure initiative, which will validate Stream A systems against workloads/benchmarks, and will procure pilot racks (Grant for Procurement).

This programme seeks to inspire new generations to pursue semiconductor careers by funding student tape-out programmes and chip design challenges.

This call supports the creation of long-term excellence hubs for university and PhD education in specialized fields like chip design and manufacturing.

This initiative networks European Vocational Education and Training (VET) providers to manage standardized qualification and certification systems for semiconductor technicians.

This collaborative call focuses on a chiplet ecosystem for AI and advanced process technologies for nodes beyond 2nm in partnership with Japanese consortia.

The aim of this call is to design and pilot a comprehensive framework to systematically monitor, assess, and report the short-, medium-, and long-term impacts of the Chips JU programmes through standardised data, indicators, and methodologies.